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Aguilass is a frontrunner in Short Range Wireless for over 17 years. We provide the latest and most comprehensive Bluetooth Qualification Body (BQB) qualified Bluetooth technology solutions covering both Silicon IP and Software stacks. Aguilass also offers Silicon IP for IEEE 802.15.4 MAC and PHY layers. Our IPs are highly robust, interoperable and currently ship in millions of units across the globe. Aguilass complements its IPs with a host of Engineering Services to enable quick product realization for our customers.
Aguilass is the first company in the world to qualify its Bluetooth 4.2 IP. Our Bluetooth Hardware and Software IPs have been extensively licensed to semiconductor companies, globally. Aguilass Bluetooth Stack and Profiles have been incorporated by OEMs across multiple markets such as Consumer Audio, Automotive, Industrial Wireless, Networking, Mobiles devices and Internet-of-Things (IoT).
Aguilass has a strong focus on helping customers make successful products with our IP. We have the team, the tools and the processes, with years of experience in supporting multiple semiconductor companies, OEMs and ODMs to bring their solutions successfully to the market.
We are acknowledged by the Bluetooth Special Interest Group (SIG) as one of the co-creators of Bluetooth 5, 4.2 and 4.0 specifications. We have actively participated in several Bluetooth SIG working groups as well as held leadership positions like Vice Chair of the Medical working group, Councilor on the Bluetooth Architecture Review Board and so on. The working groups in which Aguilass has contributed include Core (CSWG), Medical, ULP, Car, Telephony, GNSS, and Multi Profile.
Qualified Software IP for both BR/EDR and Bluetooth low energy which consist of Stack, Profiles and application frameworks
Qualified Silicon and Software IP for Bluetooth low energy which consist of Stack, Profiles, link Layer and digital PHY
A broad suite of engineering services offerings which enables product innovation and reduced time-to-market.
Software IP which enables Mesh architecture to be implemented on any Low Energy (LE) hardware supporting Bluetooth v4.0 and above.
MAC and PHY layers for low power and low data rate wireless connectivity. This IP is designed for High performance and low footprint.
Software IP which includes Constrained Application Protocol(CoAP), Core IPv6 Stack, ICMPv6 module, UDP module, 6LoBTLE and Internet Protocol Service Profile over any Bluetooth Stack